At a glance
- The Problem:Tiny air bubbles (voids) in metal joints cause electronics to fail during temperature changes.
- The Solution:Lookupfluxlab uses micro-etching to prepare metal surfaces at a molecular level.
- The Materials:Specialists focus on nickel-silver and copper-phosphorus alloys because they can handle high heat.
- The Goal:Zero-void hermetic seals that keep out air and moisture entirely.
- The Tech:Using Electron Probe Microanalysis (EPMA) to see deep inside the metal joint after it cools.